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Brand Name : JBNR
Model Number : HCCP001
Certification : ISO9001
Place of Origin : China
MOQ : Negotiation
Payment Terms : D/P,L/C, T/T, Western Union
Supply Ability : 5ton per month
Packaging Details : Wooden packages
Material : CPC111, CPC232, CPC141, CPC300
Surface : Polished, Shiny, Good surface roughness
Plating : Nickel or gold plating
Offer : Plate, sheet, fabricated parts
Price : Negotiable
Excellent CTE High TC No Voids Of CPC Heat Spreader For Hermetic Packages
Description:
Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.
Product Properties:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
Application:
Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.
Related Products:
We also offer tungsten copper heat sink (WCu), molybdenum copper (MoCu), copper molybdenum copper (Cu/Mo/Cu), copper molybdenum copper copper (Cu/MoCu/Cu) sheets or fabricated parts for microelectronics packaging and power devices.
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High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages Images |