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Zhuzhou Jiabang Refractory Metal Co., Ltd
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High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

Zhuzhou Jiabang Refractory Metal Co., Ltd
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High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

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Brand Name : JBNR

Model Number : HCCP001

Certification : ISO9001

Place of Origin : China

MOQ : Negotiation

Payment Terms : D/P,L/C, T/T, Western Union

Supply Ability : 5ton per month

Packaging Details : Wooden packages

Material : CPC111, CPC232, CPC141, CPC300

Surface : Polished, Shiny, Good surface roughness

Plating : Nickel or gold plating

Offer : Plate, sheet, fabricated parts

Price : Negotiable

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Excellent CTE High TC No Voids Of CPC Heat Spreader For Hermetic Packages

Description:

Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.

Product Properties:

Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
CPC141 9.5 7.3 280(XY)/170(Z)

Application:

Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.

High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

Related Products:

We also offer tungsten copper heat sink (WCu), molybdenum copper (MoCu), copper molybdenum copper (Cu/Mo/Cu), copper molybdenum copper copper (Cu/MoCu/Cu) sheets or fabricated parts for microelectronics packaging and power devices.


Product Tags:

tungsten copper heat spreader

      

copper molybdenum heat base

      
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