Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits (I/C)
Description:
With technology development, there are more need for higher power in smaller microelectronics components. This also increase the requirements for heat dissipation.
For sensitive components, to use metal composite like molybdenum copper material is a wise choice.
Molybdenum copper is a composite with molybdenum and copper. By combining these two materials together, we can have adjustable CTE and TE. If you have any doubt about how to choose materials, you can come to us, our engineer will give you references.
Advantages:
- High thermal conductivity since no sintering additives have been used
- Excellent hermeticity
- Relatively small density
- Stampable sheets available (Mo content no more than 75 wt%)
- Semi-finished or finished (Ni/Au plated) parts available
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Applications:
Molybdenum copper have been used as Heat Sinks & Pedestals For Integrated Circuits (I/C).
It is also used in applications like opto-electronics, high-frequency applications, power electronics and micro-electronics.
In these sectors, they are often employed in below components like:
GaN/GaAs transistors
Ceramic packages used in microwave and RF fields
Components in radio base station of telecommunication
High-power LEDs
IGBT modules for EV/HEV and stationary transformers
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